Skip to product information
1 of 6

Heltec Mesh Node T096 – GPS Built-in

Heltec Mesh Node T096 – GPS Built-in

Regular price $38.90 USD
Regular price Sale price $38.90 USD
Sale Sold out
Shipping calculated at checkout.

Mesh Node T096 is a low-power development board that integrates Bluetooth, LoRa, and GNSS. At its core, the nRF52840 MCU provides ample processing power and Bluetooth connectivity, while the SX1262 LoRa transceiver—integrated with PA—delivers transmit power of 28±1 dBm, ensuring exceptional range and link reliability. The UC6580 GNSS chip enables precise global positioning, making the device ideal for decentralized mesh networks, asset tracking, and remote sensing.

Utilizing Laser Direct Structuring (LDS) technology for both GNSS and Bluetooth antennas, the T096 achieves a compact, durable, and highly efficient antenna solution. Engineered for low-power operation, it is perfectly suited for battery-powered deployments. Fully supported by the Arduino development environment and compatible with open-source mesh projects such as Meshtastic and MeshCore, the Mesh Node T096 offers developers and enthusiasts a versatile, ready-to-use platform for building resilient, scalable mesh networks.

Kit Includes

  • Mesh Node T096 Board
  • U.FL to SMA Pigtail Cable 10cm
  • Universal 868/915MHz Stubby Antenna
  • Pigtail cables for power and solar
  • Header Pins 

Main Features

  • Supports Bluetooth, LoRa, and GNSS communication.
  • Ultra-low power consumption.
  • Maximum output power of 28±1dBm, and the LNA can be bypassed.
  • Supports GPS, GLONASS, BDS (BeiDou), Galileo, NAVIC, and QZSS.
  • Integrated lithium battery management system (charge/discharge management, overcharge protection, battery power detection, automatic switching between USB and battery power).
  • USB-C interface with comprehensive voltage regulation, ESD protection, short circuit protection, and RF shielding.
  • Supports the Arduino development framework, providing LoRa/LoRaWAN examples.
  • Compatible with Meshtastic and MeshCore.


View full details